MICROCAPSULE-CONDUCTIVE PARTICLE COMPLEX, MANUFACTURING METHOD THEREOF AND ANISOTROPIC CONDUCTIVE ADHESIVE FILM USING THE SAME

摘要

PPROBLEM TO BE SOLVED: To provide an anisotropic conductive film (ACF) capable of solving high productivity and a problem of durability against heat at the same time by inducing a low-temperature fast curing reaction of the ACF in a very low mounting temperature condition relative to an existing one while preventing an electrical short circuit by aggregation among conductive particles, in an anisotropic conductive film (ACF) using a microcapsule-conductive particle complex. PSOLUTION: This microcapsule-conductive particle complex is composed by attaching, to surfaces of conductive particles such as conductive metal particles or polymer particles each coated with a conductive metal layer, microcapsules each having a functional group having chemical affinity for metal on the surface thereof and filled with a low-temperature fast curing type curing agent organic compound for a curing resin in the inside thereof. A manufacturing method thereof is provided. This anisotropic conductive film using the microcapsule-conductive particle complex is composed. PCOPYRIGHT: (C)2008,JPO&INPIT