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MICROCAPSULE-CONDUCTIVE PARTICLE COMPLEX, PREPARATION METHOD THEREOF AND ANISOTROPIC CONDUCTIVE ADHESIVE FILM USING THE SAME
MICROCAPSULE-CONDUCTIVE PARTICLE COMPLEX, PREPARATION METHOD THEREOF AND ANISOTROPIC CONDUCTIVE ADHESIVE FILM USING THE SAME
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机译:微囊导电颗粒复合物,其制备方法以及使用该膜的各向异性导电胶膜
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摘要
The present invention relates to a microcapsule-conductive particle complex comprising a conductive particle consisting of conductive metallic particle or polymer particle coated on a surface with a conductive metallic layer; a microcapsule being adsorbed by the conductive particle or adsorbing the conductive particle, comprising a core and a shell, wherein the core contains organic compound which is a curing agent for a fast curing at a low temperature and the shell has a surface functional group with affinity for metal of the conductive metallic layer on its surface, a preparation method thereof and an anisotropic conductive film (ACF) using the same.
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