Preparation of Composite Conductive Microspheres Used in Anisotropic Conductive Adhesive Films

摘要

Polymer-based conductive adhesive materials have become widely used in many electronic packaging interconnect applications. In this paper, a new kind of polymer-based conductive particle used in anisotropic conductive adhesive films (ACFs) is prepared. The preparation of the single scattered polystyrene spheres with the particle size of 3 microns around and the less than 5% dispersion coefficient is done successfully, and a layer of nickel is coated on the surface of polystyrene spheres using chemical plating method well.