Conductive particles, the manufacturing method of their preparation and insulated conductive particles and anisotropic conductive adhesive film

摘要

PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive film which can sufficiently prevent a connection failure in the connection of a circuit electrode in which pitch is narrowed and area is narrowed, to provide a method for producing an insulated conductive particle capable of materializing the same, to provide a conductive particle capable of obtaining the insulated conductive particle, and to provide a method for producing the same.;SOLUTION: A conductive particle includes a gold layer with the average film thickness of ≤300 Å formed on a nickel layer as the outermost layer, and the elemental composition ratio between nickel and gold (Ni/Au) on the surface of the conductive particle by X-ray photoelectron spectroscopy analysis is ≤0.4.;COPYRIGHT: (C)2009,JPO&INPIT