DICING DIE BOND FILM SUITABLE FOR PROCESSING OF THIN WAFER

摘要

A dicing die bond film suitable for processing a thin film wafer is provided to remove a chip flying effect by increasing fixing force to a ring frame. A dicing die bond film includes a supporting base layer, an adhesive layer, and a fixing adhesive layer. The adhesive layer includes a lower adhesive layer(32) and an upper adhesive layer(22). The lower adhesive layer is laminated on the supporting base layer. The upper adhesive layer is laminated on the lower adhesive layer. The peel strength between the lower adhesive layer and the ring frame is 0.007N/mm to 1.000N/mm. The peel strength between the upper adhesive and the fixing adhesive layer is 0.002N/mm to 0.020N/mm after the peel strength. Further, the upper adhesive layer contains 30-90 wt.% of acryl copolymer, 10-70 wt.% of acryl compound and 0.1-10 wt.% of photoinitiator based on 100 wt.% of the upper adhesive layer.