首页> 外国专利> METHOD OF MANUFACTURING SURFACE-MODIFIED SINGLE CRYSTAL SiC SUBSTRATE, SINGLE CRYSTAL SiC SUBSTRATE WITH EPITAXIAL GROWTH LAYER, SEMICONDUCTOR CHIP, SEED SUBSTRATE FOR SINGLE CRYSTAL SiC GROWTH, AND POLYCRYSTAL SiC SUBSTRATE WITH SINGLE CRYSTAL GROWTH LAYER

METHOD OF MANUFACTURING SURFACE-MODIFIED SINGLE CRYSTAL SiC SUBSTRATE, SINGLE CRYSTAL SiC SUBSTRATE WITH EPITAXIAL GROWTH LAYER, SEMICONDUCTOR CHIP, SEED SUBSTRATE FOR SINGLE CRYSTAL SiC GROWTH, AND POLYCRYSTAL SiC SUBSTRATE WITH SINGLE CRYSTAL GROWTH LAYER

机译:制造表面改性的单晶SiC基质,具有表观生长层的单晶SiC基质,半导体芯片,用于单晶SiC增长的种子基质以及多晶硅SiC基质的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a vapor phase technology that can modify the top surface of the crystal polymorphism of an original single crystal SiC substrate into the 4H-SiC single crystal regardless of any shape of crystal polymorphism.;SOLUTION: A single crystal SiC substrate 5 the crystal polymorphism of which consists of any one of 3C, 4H or 6H is heated under a high-vacuum environment to form a carbonized layer 5a on the top surface of the single crystal SiC substrate. Subsequently, the single crystal SiC substrate is accommodated in a fitted vessel having a carbon getter effect, and with the inside of the fitted vessel kept under the silicon saturation vapor pressure and high-temperature vacuum conditions, the fitted vessel is further heated while maintaining a state where the internal pressure of the fitted vessel becomes higher than the external pressure, which generates an amorphous SiC layer 5b by making the carbonized layer 5a react to silicon. Further, by heating the single crystal SiC substrate accommodated in the fitted vessel in the same condition as the above, at least a part of the amorphous SiC on the sacrifice growth layer is recrystallized to generate a single crystal 4H-SiC layer 5c.;COPYRIGHT: (C)2009,JPO&INPIT
机译:要解决的问题:提供一种气相技术,可以将原始单晶SiC衬底的晶体多态性的顶表面修改为4H-SiC单晶,而与晶体多态性的任何形状无关;解决方案:单晶SiC在高真空环境下加热其晶体多态性由3C,4H或6H中的任一种组成的衬底5,以在单晶SiC衬底的顶表面上形成碳化层5a。随后,将单晶SiC衬底容纳在具有碳吸收作用的装配容器中,并且在将装配容器的内部保持在硅饱和蒸气压和高温真空条件下的同时,在保持高温的同时进一步加热装配容器。在该状态下,通过使碳化层5a与硅反应,生成非晶SiC层5b。此外,通过以与上述相同的条件加热容纳在装配的容器中的单晶SiC衬底,使牺牲生长层上的非晶SiC的至少一部分重结晶以生成单晶4H-SiC层5c。 :(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP2009188117A

    专利类型

  • 公开/公告日2009-08-20

    原文格式PDF

  • 申请/专利权人 KWANSEI GAKUIN;

    申请/专利号JP20080025483

  • 发明设计人 KANEKO TADAAKI;

    申请日2008-02-05

  • 分类号H01L21/20;

  • 国家 JP

  • 入库时间 2022-08-21 19:45:56

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