PRETREATMENT LIQUID FOR PROMOTING STARTING OF ELECTROLESS PALLADIUM PLATING REACTION, ELECTROLESS PLATING METHOD USING THE PRETREATMENT LIQUID, CONNECTION TERMINAL FORMED BY THE ELECTROLESS PLATING METHOD, AND SEMICONDUCTOR PACKAGE USING THE CONNECTION TERMINAL AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a pretreatment liquid for promoting starting of electroless palladium plating reaction for forming a film of uniform thickness by suppressing non-formation of electroless palladium plating film formed on a plated body functioned as a protective layer for an electroless nickel plating alloy film or reduction in thickness, an electroless plating method using the same, a connection terminal, a semiconductor package using the connection terminal, and its manufacturing method.;SOLUTION: Disclosed are the pretreatment liquid for promoting starting of electroless palladium plating reaction for immersing the electroless palladium plating film before forming to promote starting of the electroless palladium plating reaction when performing depositing the electroless nickel plating alloy film, the electroless palladium plating film, and a substitution gold plating film on the plated body, or further performing electroless plating for depositing the electroless plating film, the electroless plating method using the pretreatment liquid, the connection terminal formed by the electroless plating method, the semiconductor package using the connection terminal, and its manufacturing method.;COPYRIGHT: (C)2009,JPO&INPIT