A pretreatment liquid for electroless plating, an electroless plating bath and an electroless plating method (PRETREATMENT SOLUTION FOR ELECTROLESS PLATING, ELECTROLESS PLATING BATH AND ELECTROLESS PLATING METHOD)

摘要

An electroless plating technique capable of positively advancing the plating reaction without performing the Pd substitution treatment and capable of accelerating the precipitation of plating can be applied to a primary plating film (or a metal film) formed on a substrate by a secondary plating (Electroless plating), wherein the surface potential of the primary plating film is higher than the lowest surface potential at which the surface current density of the primary plating film becomes 0 in the electroless plating solution of the secondary plating And a second plating step is carried out after adjusting the thickness of the electroless plating bath so as to be further lowered, and a pretreatment liquid for electroless plating containing a pH adjusting agent, a reducing agent and a complexing agent suitable for use in carrying out the electroless plating bath and the electroless plating bath .