PRETREATMENT SOLUTION FOR ELECTROLESS PLATING, ELECTROLESS PLATING BATH AND ELECTROLESS PLATING METHOD

摘要

Plating reaction can be reliably promoted without performing Pd substitution treatment, and electroless plating technique can be used to speed up plating deposition. Secondary plating is performed on a primary plating film (or metal film) formed on a substrate. In the electroless plating method of performing electroless plating, the surface potential of the primary plating film is lower than the lowest surface potential at which the surface current density of the primary plating film becomes zero in the electroless plating solution of the secondary plating. Electroless plating method characterized in that the secondary plating is carried out after adjusting to a lower level, and an electroless plating pretreatment liquid and an electroless plating bath containing a pH adjuster, a reducing agent and a complexing agent suitable for use in performing the same. Suggest.