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PRETREATMENT SOLUTION FOR ELECTROLESS PLATING, ELECTROLESS PLATING BATH AND ELECTROLESS PLATING METHOD
PRETREATMENT SOLUTION FOR ELECTROLESS PLATING, ELECTROLESS PLATING BATH AND ELECTROLESS PLATING METHOD
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机译:无电电镀,无电电镀浴和无电电镀方法的预处理解决方案
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摘要
As an electroless plating technique capable of surely promoting the plating reaction without Pd substitution reaction and fastening the plating deposition, there are proposed an electroless plating method of subjecting a primary plated film (or metal film) formed on a substrate to a secondary plating (or electroless plating), characterized in that the secondary plating is carried out after a surface potential of the primary plated film is adjusted so as to be more base than such a most base surface potential that a surface current density of the primary plated film is zero in an electroless plating solution for the secondary plating, and a pretreating solution for electroless plating containing pH adjusting agent, reducing agent and complexing agent and an electroless plating bath suitable for use in this method.
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