CONNECTION TERMINAL AND SEMICONDUCTOR CHIP MOUNTING SUBSTRATE USING THE SAME, SEMICONDUCTOR CHIP MOUNTING SUBSTRATE MANUFACTURING METHOD, ELECTROLESS PLATING PRETREATMENT METHOD, AND ELECTROLESS PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a connection terminal in which both bridge and skip do not occur, and to provide a method of manufacturing a semiconductor chip mounting substrate using the connection terminal.;SOLUTION: The connection terminal formed on the surface of the substrate comprises a base material 5 and conductors 4 (connection terminals) formed on the base material. Herein, the upper faces or the side faces of the conductors are covered with an electroless plated coat 17 and the thickness of the electroless plated coat on part of the side faces of the conductors is the same as or smaller than the thickness of the electroless plated coat on the upper faces of the conductors, or all of the upper faces of the conductors is covered with the electroless plated coat and part of the side faces of the conductors is covered with the electroless plated coat or all of the side faces of the conductors is not covered with the electroless plated coat.;COPYRIGHT: (C)2009,JPO&INPIT