METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ELECTRONIC COMPONENT, AND SEMICONDUCTOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To enable an adsorption jig for use in a semiconductor device manufacturing technology to be heat-resistant at 300°C or more.;SOLUTION: The adsorption jig such as a collet 60 and the like mounted on a collet holder 61 is provided with high heat resistance. Adoption of such structure as above allows the collet 60 which has so far caused heat deterioration at temperature applied in gold/tin eutectic bonding and the like to be used without causing the heat deterioration and the like. A predetermined high heat resistance silicon resin is preferably used for the high heat resistance. Such a commercial product as FX-T154 can be enumerated as an example. The high heat resistance silicon resin whose Shore A hardness is 10 to 90 is preferably used. Further, proper conductivity may be applied to the high heat resistance silicon resin by adding conductive agent thereto.;COPYRIGHT: (C)2009,JPO&INPIT