PACKAGE STRUCTURE, PRINTED CIRCUIT BOARD MOUNTED WITH THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a package structure which prevents destruction of a junction part between a package substrate and an LSI or a junction part between the LSI and a heat spreader to improve the reliability while having a simple configuration, a printed circuit board mounted with the package structure, and an electronic apparatus including the printed circuit board.;SOLUTION: The package structure can be mounted on an external printed circuit board 200 and includes: a package substrate 110 mounted with a heat generating circuit element 102; a heat spreader 150 for transmitting heat from the heat generating circuit element to a heat sink 190 for dissipating the heat of the heat generating circuit element; a junction member 140 for sealing up a space between the heat generating circuit element and the heat spreader to form a closed space CA together with the heat generating circuit element and the heat spreader; and a liquid metal 160 enclosed in the closed space. The junction member is a solid metal connecting the heat generating circuit element and the heat spreader on the outer periphery of the heat generating circuit element and containing copper or aluminum.;COPYRIGHT: (C)2009,JPO&INPIT