首页> 外文OA文献 >Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future.Basic Consideration on the Multi-Layer Printed Circuit Boards from the View Point of Electronic Design.

【2h】

Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future.Basic Consideration on the Multi-Layer Printed Circuit Boards from the View Point of Electronic Design.

机译：高密度多层印刷电路板的最近进展及朝向未来的讨论。电子设计视点多层印刷电路板的考虑。

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Hidetaka HAYASHI; Noboru SCHIBUYA;
展开▼
作者单位

展开▼
年度 1994
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Current Estimation On Multi-layer Printed Circuit Board With Lumped Circuits By Near-field Measurement [J] . Sumito KATO, Qiang CHEN, Kunio SAWAYA IEICE Transactions on Communications . 2008,第11期

机译：通过近场测量估算具有集总电路的多层印刷电路板上的电流
2. SAVIA, an advanced multi-layer parallel lamination technique for high density, high performance printed circuit boards [J] . Taehoon Kim, Jee-Soo Mok, Chang-Kyu Song, Circuit World . 2005,第3期

机译：SAVIA，一种用于多层高密度，高性能印刷电路板的先进多层平行层压技术
3. Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards [J] . Kim Do-Hyoung, Joo Sung-Jun, Kwak Dong-Ok, Journal of Micromechanics and Microengineering . 2015,第10期

机译：铜图案/可光成像阻焊剂复合材料的各向异性粘弹性壳建模技术，用于多层印刷电路板的翘曲仿真
4. TWISTED WIRE INTERCONNECTS: AN ALTERNATIVE TO MULTI-LAYER BOARD CONSTRUCTION FOR HIGH COMPONENT DENSITY PRINTED CIRCUIT BOARD ASSEMBLIES [C] . Steve Garcia, Randy Boudreaux, Tom Borkes SMTA International Conference and the Technology Showcase . 2007

机译：双绞线互连：用于高分子密度印刷电路板组件的多层板结构的替代方案
5. Modeling and design of DC power bus interconnects, segmentation, and signal via transitions in multi-layer printed circuit boards using FDTD and a mixed-potential integral equation approach with circuit extraction. [D] . Cui, Wei. 2001

机译：使用FDTD和带有电路提取的混合电位积分方程方法，对多层印刷电路板中的DC电源总线互连，分段和信号过渡进行建模和设计。
6. Direct-referencing Two-dimensional-array Digital Microfluidics Using Multi-layer Printed Circuit Board [O] . Jian Gong, Chang-Jin CJ Kim -1

机译：使用多层印刷电路板的直接参照二维阵列数字微流控技术
7. Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Low Dielectric Constant High Density Multilayer Printed Wiring Board for Large Scale Computer. [O] . Motoyo WAJIMA 1994

机译：高密度多层印刷电路板的最新进展及对未来的讨论。利用多层印刷电路板在高级应用中的应用。用于大型计算机的低介电常数高密度多层印刷线路。

Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future.Basic Consideration on the Multi-Layer Printed Circuit Boards from the View Point of Electronic Design.

著录项

引文网络

相似文献

相关主题

期刊订阅