As formation manner of the minute metal structure and the ceramic package which uses that, the substrate for multichip and substrate null

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a micro metal structural body having excellent characteristics as a conductor circuit, a metal component or the like, and a ceramic package, a multi-chip substrate and PDP substrate each having better characteristics than before using the above method.;SOLUTION: In a forming method of a micro metal structural body, conductive paste containing metal powder with an average particle size of 400 nm or less as a conductive component is put under pattern formation into a given shape to obtain a micro metal structural body. The method is used for forming a conductor circuit for a ceramic package, a multi-chip substrate, and a PDP substrate.;COPYRIGHT: (C)2003,JPO