Millimeter-wave multichip BGA package for InP circuits utilizing a laminated ceramic and organic substrate

摘要

The packaging of millimeter-wave Indium Phosphide (InP) Application Specification Integrated Circuits (ASICs) presents significant challenges particularly with respect to high speed signal interconnections and thermal management. A packaging technology for multichip InP systems is presented that combines the advantageous thermal and electrical properties of traditional ceramic and metal RF microcircuits with the high density and surface mount capabilities of an organic ball grid array (BGA). A specific 50 mm body outline design housing five custom InP ASICs comprising the front-end circuits of a 32 GHz real time oscilloscope is presented as an example of this device. The package and substrate components are described in detail. Fabrication and assembly processes are described. Electrical and thermal performance simulation and verification is presented. Reliability test results are presented.