首页> 外国专利> SELF-ALIGNED VERTICAL PNP TRANSISTOR FOR HIGH PERFORMANCE SiGe CBiCMOS PROCESS

SELF-ALIGNED VERTICAL PNP TRANSISTOR FOR HIGH PERFORMANCE SiGe CBiCMOS PROCESS

机译:用于高性能SiGe CBiCMOS工艺的自对准垂直PNP晶体管

摘要

A structure and a process for a self-aligned vertical PNP transistor for high performance SiGe CBiCMOS process. Embodiments include SiGe CBiCMOS with high-performance SiGe NPN transistors and PNP transistors. As the PNP transistors and NPN transistors contained different types of impurity profile, they need separate lithography and doping step for each transistor. The process is easy to integrate with existing CMOS process to save manufacturing time and cost. As plug-in module, fully integration with SiGe BiCMOS processes. High doping Polysilicon Emitter can increase hole injection efficiency from emitter to base, reduce emitter resistor, and form very shallow EB junction. Self-aligned N+ base implant can reduce base resistor and parasitical EB capacitor. Very low collector resistor benefits from BP layer. PNP transistor can be Isolated from other CMOS and NPN devices by BNwell, Nwell and BN+ junction.
机译:用于高性能SiGe CBiCMOS工艺的自对准垂直PNP晶体管的结构和工艺。实施例包括具有高性能SiGe NPN晶体管和PNP晶体管的SiGe CBiCMOS。由于PNP晶体管和NPN晶体管包含不同类型的杂质分布,因此它们需要对每个晶体管进行单独的光刻和掺杂步骤。该工艺易于与现有CMOS工艺集成,以节省制造时间和成本。作为插件模块,与SiGe BiCMOS工艺完全集成。高掺杂多晶硅发射极可以提高从发射极到基极的空穴注入效率,减少发射极电阻,并形成非常浅的EB结。自对准N +基极注入可以减少基极电阻和寄生EB电容器。极低的集电极电阻受益于BP层。 PNP晶体管可以通过BNwell,Nwell和BN +结与其他CMOS和NPN器件隔离。

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