首页> 外国专利> Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus

Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus

机译:电化学机械抛光方法和电化学机械抛光设备

摘要

A composite electrolytic processing method makes it possible to remove a conductive film without leaving it in an electrically-insulated state on an underlying barrier film, thereby exposing the barrier film. The electrochemical mechanical polishing method includes: applying a voltage between a first electrode connected to one pole of a power source and a second electrode, connected to the other pole of the power source, for feeding electricity to a conductive film of a polishing object; filling an electrolytic liquid into a space between the first electrode and the conductive film of the polishing object; and pressing and rubbing the conductive film against a polishing surface of a polishing pad to polish the conductive film in such a manner that a barrier film underlying the conductive film becomes gradually exposed from the center toward the periphery of the polishing object.
机译:复合电解处理方法使得可以去除导电膜而不将其保持在电绝缘状态下在下面的阻挡膜上,从而露出阻挡膜。该电化学机械抛光方法包括:在连接至电源的一个极的第一电极与连接至电源的另一极的第二电极之间施加电压,以将电力馈送到抛光对象的导电膜;将电解液体填充到第一电极和抛光物体的导电膜之间的空间中;将导电膜压在抛光垫的抛光表面上并对其进行摩擦,以使导电膜下面的阻挡膜从中心向抛光对象的周围逐渐暴露,从而对该导电膜进行抛光。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号