N2 BASED PLASMA TREATMENT FOR ENHANCED SIDEWALL SMOOTHING AND PORE SEALING OF POROUS LOW-K DIELECTRIC FILMS

摘要

A method of forming a semiconductor device including forming a low-k dielectric material over a substrate, depositing a liner on a portion of the low-k dielectric material, and exposing the liner to a plasma. The method also includes depositing a layer over the liner.