FLIP CHIP MOUNT TYPE OF BUMP, MANUFACTURING METHOD THEREOF, AND BONDING METHOD FOR FLIP CHIP USING NON CONDUCTIVE ADHESIVE

摘要

Disclosed are a flip chip bump (30), a manufacturing method thereof, and a flip chip bonding method using a non-conductive adhesive (70). More particularly, disclosed are a flip chip bump (30) having a spherical or mushroom shape, which can increase the effect of plastic deformation by virtue of a low pressure applied during flip chip bonding and achieve improved durability by reducing the trapping of a non-conductive adhesive (70) therein and consequently, improved reliability of the bonding joint, a method for manufacturing the flip chip bump (30), and a flip chip bonding method.