首页> 外国专利> METHOD FOR FORMING THIN FILM SILICON USING METAL INDUCED GROWTH AND ELECTRONIC DEVICE MANUFACTURED THIN FILM SILICON BY THE SAME

METHOD FOR FORMING THIN FILM SILICON USING METAL INDUCED GROWTH AND ELECTRONIC DEVICE MANUFACTURED THIN FILM SILICON BY THE SAME

机译:利用金属诱导的生长形成薄膜硅的方法以及由该方法制造的电子设备制造薄膜硅

摘要

The thin-film silicon formation method using the metallic catalyst growth is provided to reduce the process cost and to form the thin film silicon layer of the large area by forming the thin-film silicon of the micro size through the metallic catalyst method of growth. The thin-film silicon formation method using the metallic catalyst growth comprises as follows. A step is for forming the metal layer at the upper part of the substrate(1). A step is for forming the silicide layer(2) by silicidating the metal layer. A step is for forming the crystalline thin film silicon layer(3) by growing silicide layer through the continuous silicon supply. The thin film silicon layer of the large area by forming the thin-film silicon of the micro size can be formed.
机译:提供了一种利用金属催化剂生长的薄膜硅形成方法,以通过金属催化剂生长法形成微小尺寸的薄膜硅,从而降低工艺成本并形成大面积的薄膜硅层。利用金属催化剂生长的薄膜硅形成方法包括如下。步骤是在衬底(1)的上部形成金属层。步骤是通过硅化金属层来形成硅化物层(2)。步骤是通过通过连续的硅供给来生长硅化物层来形成晶体薄膜硅层(3)。通过形成微小尺寸的薄膜硅,可以形成大面积的薄膜硅层。

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