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FABRICATION METHOD OF LARGE SIZED GALLIUM NITRIDE THICK FILM

机译:大尺寸氮化镓厚膜的制备方法

摘要

A method for fabricating a large sized gallium nitride thick film is provided to obtain the gallium nitride thick film with high quality having the uniform thickness distribution and isotropic stress distribution by growing the gallium nitride thick film without a defect rapidly. A base substrate(110) for growing a GaN film is positioned inside a film growth reaction bath(100). The base substrate has different temperature according to a position by giving a temperature gradient according to the position of the base substrate. The reaction gas(120) is supplied from the inlet of the reaction bath to the base substrate. The GaN thick film is grown on the base substrate. The temperature gradient is given in a temperature range above a critical point in the base substrate.
机译:提供一种制造大尺寸的氮化镓厚膜的方法,以通过快速生长无缺陷的氮化镓厚膜来获得具有均匀的厚度分布和各向同性应力分布的高质量的氮化镓厚膜。用于生长GaN膜的基础衬底(110)位于膜生长反应浴(100)内。通过根据基础基板的位置给出温度梯度,基础基板根据位置具有不同的温度。从反应浴的入口将反应气体(120)供应至基础基板。在基础衬底上生长GaN厚膜。温度梯度是在基础基板中高于临界点的温度范围内给出的。

著录项

  • 公开/公告号KR20090011524A

    专利类型

  • 公开/公告日2009-02-02

    原文格式PDF

  • 申请/专利权人 SAMSUNG CORNING PRECISION GLASS CO. LTD.;

    申请/专利号KR20070075182

  • 发明设计人 SHIN HYUN MIN;LEE KI SOO;

    申请日2007-07-26

  • 分类号H01L21/20;H01L21/205;

  • 国家 KR

  • 入库时间 2022-08-21 19:14:02

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