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Aluminum gallium nitride / gallium nitride high electron mobility transistor fabrication and characterization

机译:氮化铝镓/氮化镓高电子迁移率晶体管的制备与表征

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摘要

In the last decade, All-,GaXN/GaN High Electron Mobility Transistors (HEMTs) have been intensively studied because their intrinsic electrical properties make them attractive for high power microwave device applications. Despite much progress, current slump continues to be a problem, limiting output power, reducing reliability, and complicating device modelling. In this work, a complete A~I-,G~,N/G~N HEMT fabrication procedure was developed, and electrical characteristics related to current slump, microwave modelling, and delay time analysis were explored. Low resistance ohmic contacts were achieved, enabling high channel current densities. Schottky contacts were developed with a new ion implant isolation architecture, enabling gate leakage currents 2 to 4 orders of magnitude lower than typical results from the literature. Through pulsed current-voltage measurements, the importance of bias stresses in the gate-source region was demonstrated for the first time. In contrast to the conventional "virtual gate" model, gate-source stresses were shown to be more important than gatedrain stresses when biased near threshold. Slow slump transients were studied by passivating transistor surfaces with ultrathin layers. These results excluded dielectric strain and electron injection reduction as viable passivation mechanisms. A novel model was proposed associating slow slump behaviour with trapping of many electrons at screw dislocation sites. The effect of slump on RF properties was examined through microwave measurements by extracting the parasitic source and drain resistances without special biasing. Besides significantly improving the accuracy of small-signal modelling, we were able to show the bias dependence of parasitic resistances which confirmed the effect of source-side bias stressing. The question of channel electron velocities in nitride transistors remains controversial. We determined an effective electron velocity of - 1.9 x 1 o7 cmls through two methods. We first extracted effective velocities through delay time analysis, and then through the small-signal model elements. To our knowledge, this was the first time an equivalent model extraction led to self-consistent electron velocity values for nitride transistors. Finally, our equivalent circuit model showed the correct interrelation between frequency response and access resistances. The cohesive picture of current slump, equivalent circuit model extraction, and delay time analysis gives a high degree of confidence in these results.
机译:在过去的十年中,由于其固有的电学特性使其对高功率微波器件的应用具有吸引力,因此对All-,GaXN / GaN高电子迁移率晶体管(HEMT)进行了深入研究。尽管取得了很大进展,但电流下降仍然是一个问题,限制了输出功率,降低了可靠性,并使设备建模复杂化。在这项工作中,开发了完整的A〜I-,G〜,N / G〜N HEMT制造程序,并探索了与电流下降,微波建模和延迟时间分析有关的电特性。实现了低电阻欧姆接触,从而实现了高沟道电流密度。肖特基接触件采用新的离子注入隔离结构开发,可使栅极泄漏电流比文献中的典型结果低2至4个数量级。通过脉冲电流-电压测量,首次证明了栅-源区中偏置应力的重要性。与传统的“虚拟栅极”模型相反,当偏置在阈值附近时,栅极-源极应力比栅极-漏极应力更重要。通过钝化具有超薄层的晶体管表面来研究缓慢的坍落瞬变。这些结果排除了电介质应变和电子注入减少作为可行的钝化机理的可能性。提出了一种新颖的模型,该模型将慢速坍落度行为与许多在螺位错位点处的电子捕获相关联。坍落度对射频特性的影响是通过微波测量通过提取寄生的源极和漏极电阻而没有特殊偏置来检查的。除了显着提高小信号建模的准确性外,我们还能够显示寄生电阻的偏置依赖性,从而证实了源极侧偏置应力的作用。氮化物晶体管中的沟道电子速度问题仍然存在争议。我们通过两种方法确定了-1.9 x 1 o7 cmls的有效电子速度。我们首先通过延迟时间分析,然后通过小信号模型元素来提取有效速度。据我们所知,这是第一次等效模型提取导致氮化物晶体管的电子速度值自洽。最后,我们的等效电路模型显示了频率响应和访问电阻之间的正确相互关系。电流下降,等效电路模型提取和延迟时间分析的内聚力图使这些结果具有高度的可信度。

著录项

  • 作者

    DiSanto David;

  • 作者单位
  • 年度 2005
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  • 原文格式 PDF
  • 正文语种 English
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