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METHOD FOR MAMUFACTURING A ALUMINA COMPLEX CAPILLARY FOR SEMICONDUCTOR WIRE BONDING AND ALUMINA COMPLEX CAPILLARY FOR SEMICONDUCTOR WIRE BONDING USING THEREOF
METHOD FOR MAMUFACTURING A ALUMINA COMPLEX CAPILLARY FOR SEMICONDUCTOR WIRE BONDING AND ALUMINA COMPLEX CAPILLARY FOR SEMICONDUCTOR WIRE BONDING USING THEREOF
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机译:用其制造制造用于铝线焊接的铝复合毛细管和用于铝线的铝复合毛细管的方法
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摘要
A method for manufacturing an alumina complex capillary for a semiconductor wire bonding and the alumina complex capillary are provided to improve a bonding by obtaining a product having a wire bonding alumina and a complex capillary. A fine alumina powder is made of an alumina powder 90.0 weight% to 97.0 weight%, a zirconia powder 1.0 weight% to 8.0 weight%, 85 weight%, an ethylene resin group 5 weight% to 20 weight%, wax type 3 weight% to 10 weight% is formed(S10), a chrome oxide powder 0.5 weight% to 3 weight%. A molding product of the capillary shape is shaped as the formed slurry(S20), and the capillary molding product from which the binder is removed successively is heated by a temperature of 950°C to 1550°C.
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