首页> 外国专利> NONVOLATILE MEMORY DEVICE USING AN IMPURITY TRAP FORMED BY A METAL DOPING AS A CHARGE STORAGE LEVEL AND A MANUFACTURING METHOD THEREOF

NONVOLATILE MEMORY DEVICE USING AN IMPURITY TRAP FORMED BY A METAL DOPING AS A CHARGE STORAGE LEVEL AND A MANUFACTURING METHOD THEREOF

机译:利用金属掺杂形成的杂质陷阱作为电荷存储层的非易失性存储器及其制造方法

摘要

A non-volatile memory device using the impurity trap formed by the metal doping and a manufacturing method thereof are provided to heighten the reliability of device by forming the trap into the atomic unit. A memory device including an ion-implanted alumina layer(16) are rapidly and thermally processed. The aluminum is deposited to use the memory device which is rapidly thermally processed as an electrode(18). A silicon oxide film is deposited by the thickness of 5nm by the thermal deposition on the p-type silicon substrate(12). The alumina layer is deposited by 40nm thickness on the silicon oxide film through the method for atomic layer deposition. The layer generated by the ion-implanted metal(15) is used as the charge storage level.
机译:提供一种使用通过金属掺杂形成的杂质陷阱的非易失性存储器件及其制造方法,以通过将陷阱形成为原子单元来提高器件的可靠性。包括离子注入的氧化铝层(16)的存储器件被快速且热处理。沉积铝以使用快速热处理的存储器件作为电极(18)。通过热沉积在p型硅衬底(12)上沉积厚度为5nm的氧化硅膜。通过原子层沉积的方法在氧化铝膜上沉积40nm厚的氧化铝层。由离子注入金属(15)产生的层用作电荷存储能级。

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