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NONVOLATILE MEMORY DEVICE USING AN IMPURITY TRAP FORMED BY A METAL DOPING AS A CHARGE STORAGE LEVEL AND A MANUFACTURING METHOD THEREOF
NONVOLATILE MEMORY DEVICE USING AN IMPURITY TRAP FORMED BY A METAL DOPING AS A CHARGE STORAGE LEVEL AND A MANUFACTURING METHOD THEREOF
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机译:利用金属掺杂形成的杂质陷阱作为电荷存储层的非易失性存储器及其制造方法
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摘要
A non-volatile memory device using the impurity trap formed by the metal doping and a manufacturing method thereof are provided to heighten the reliability of device by forming the trap into the atomic unit. A memory device including an ion-implanted alumina layer(16) are rapidly and thermally processed. The aluminum is deposited to use the memory device which is rapidly thermally processed as an electrode(18). A silicon oxide film is deposited by the thickness of 5nm by the thermal deposition on the p-type silicon substrate(12). The alumina layer is deposited by 40nm thickness on the silicon oxide film through the method for atomic layer deposition. The layer generated by the ion-implanted metal(15) is used as the charge storage level.
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