SEMICONDUCTOR MEMORY DEVICE COMPRISING A MEMORY MODULE OF STACKING MEMORY CHIPS, CAPABLE OF REDUCING POWER CONSUMPTION

摘要

PURPOSE: A semiconductor memory device comprising a memory module of stacking memory chips are provided to reduce the length of a channel where a signal is transmitted.;CONSTITUTION: A semiconductor memory device(300) has m substrate and n laminate memory. N laminate memory includes an n interface chip(n is the natural number) and a plurality of memory chips. N interface chip are connected to each substrate, and a plurality of memory chips are laminated on each interface chip in the vertical direction. A K-th interface chip(a k is the natural number less than n-1 over 1) of transmits a signal to the k+1 interface chip of connected to the same substrate.;COPYRIGHT KIPO 2010