首页> 外国专利> Plazma etching method for forming piramidal texture on silicon surface

Plazma etching method for forming piramidal texture on silicon surface

机译:在硅表面上形成金字塔形纹理的等离子刻蚀方法

摘要

The present invention relates to a plasma etching method and apparatus for forming a pyramidal texture on a surface of silicon substrate used for solar cell or the like. More par¬ ticularly, the present invention relates to a plasma etching method and apparatus, wherein there are provided a plasma generator having gas injection holes for injecting etching gas activated by plasma and a gas supply unit for supplying high pressure etching gas to the plasma generator, and an etching reaction is induced on a surface of silicon substrate by particles of etching gas injected at a high flow rate under a pressure of 1 Torr or more to thereby form a pyramidal texture, whereby the structure of the etching apparatus can be simplified since an additional device for maintaining a high vacuum state is not required, and the reaction efficiency can be enhanced by etching gas particles of high density.
机译:等离子体蚀刻方法和装置技术领域本发明涉及在用于太阳能电池等的硅基板的表面上形成棱锥纹理的等离子体蚀刻方法和装置。更具体地,本发明涉及一种等离子体蚀刻方法和设备,其中提供了一种等离子体发生器,该等离子体发生器具有用于注入被等离子体激活的蚀刻气体的气体注入孔和用于向该等离子体发生器提供高压蚀刻气体的气体供应单元。并且,通过在1Torr以上的压力下以高流量注入的蚀刻气体的粒子在硅基板的表面上引起蚀刻反应,从而形成棱锥状的结构,因此,可以简化蚀刻装置的结构,因为不需要用于维持高真空状态的附加装置,并且可以通过蚀刻高密度的气体颗粒来提高反应效率。

著录项

  • 公开/公告号KR100890994B1

    专利类型

  • 公开/公告日2009-03-31

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20070074671

  • 发明设计人 이헌주;플락신 바딤 유레비치;

    申请日2007-07-25

  • 分类号H01L21/3065;

  • 国家 KR

  • 入库时间 2022-08-21 19:12:05

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号