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Halogen-induced modification of silicon surfaces: Etching roughening, and step transformations.

机译:卤素诱导的硅表面改性:蚀刻粗糙化和阶跃转变。

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摘要

I have combined scanning tunneling microscopy with density functional calculations and Monte Carlo simulations to investigate halogen-induced modifications of Si surfaces, including etching, roughening and step transformations. These investigations have focused on elucidating the atomic-level details associated with the evolution of terrace and step sites on Cl-Si(100)-(2x1) under conditions of halogen supersaturation. I present a novel adsorption mechanism that is accessed upon exposing nearly-saturated Cl-Si(100)-(2x1) to a flux of Cl 2, whereby dangling bonds of the nearly-saturated surface mediate the insertion of Cl adsorbates into non-equilibrium adsorption sites. The adsorbates are kinetically trapped within these sites due to energy constraints and lack of available and more favorable adsorption sites. Inserted Cl adsorbates force the surface to evolve along a novel etching pathway at elevated temperature resulting in dimer vacancy formation without the customary Si regrowth features attributed to halogen etching processes. This process is investigated at 700 -- 825 K and the reaction mechanism is extracted from analysis of the appropriate rate equations.
机译:我将扫描隧道显微镜与密度泛函计算和蒙特卡洛模拟相结合,以研究卤素诱导的硅表面改性,包括蚀刻,粗糙化和阶梯变换。这些研究的重点是阐明与卤素过饱和条件下Cl-Si(100)-(2x1)上台阶和台阶部位的演化有关的原子级细节。我提出了一种新颖的吸附机制,该机制是在将近饱和的Cl-Si(100)-(2x1)暴露于Cl 2的通量时访问的,由此,近饱和表面的悬空键介导了Cl吸附物插入非平衡态吸附位。由于能量限制以及缺乏可用的和更有利的吸附位,吸附剂被动力学地捕获在这些位点内。插入的Cl吸附物迫使表面在高温下沿着新的蚀刻路径​​发展,导致形成二聚体空位,而没有归因于卤素蚀刻工艺的常规Si再生特征。在700-825 K下对这一过程进行了研究,并从适当的速率方程分析中提取了反应机理。

著录项

  • 作者

    Butera, Robert E.;

  • 作者单位

    University of Illinois at Urbana-Champaign.;

  • 授予单位 University of Illinois at Urbana-Champaign.;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 107 p.
  • 总页数 107
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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