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Halogen-induced modification of silicon surfaces: etching roughening, and step transformations

机译:卤素诱导的硅表面改性:蚀刻粗糙化和阶梯转换

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摘要

I have combined scanning tunneling microscopy with density functional calculations and Monte Carlo simulations to investigate halogen-induced modifications of Si surfaces, including etching, roughening and step transformations. These investigations have focused on elucidating the atomic-level details associated with the evolution of terrace and step sites on Cl-Si(100)-(2x1) under conditions of halogen supersaturation. I present a novel adsorption mechanism that is accessed upon exposing nearly-saturated Cl-Si(100)-(2x1) to a flux of Cl2, whereby dangling bonds of the nearly-saturated surface mediate the insertion of Cl adsorbates into non-equilibrium adsorption sites. The adsorbates are kinetically trapped within these sites due to energy constraints and lack of available and more favorable adsorption sites. Inserted Cl adsorbates force the surface to evolve along a novel etching pathway at elevated temperature resulting in dimer vacancy formation without the customary Si regrowth features attributed to halogen etching processes. This process is investigated at 700 ??? 825 K and the reaction mechanism is extracted from analysis of the appropriate rate equations.
机译:我将扫描隧道显微镜与密度泛函计算和蒙特卡洛模拟相结合,以研究卤素诱导的硅表面改性,包括蚀刻,粗糙化和阶梯变换。这些研究集中于阐明与卤素过饱和条件下Cl-Si(100)-(2x1)上台阶和台阶位点的演化有关的原子级细节。我提出了一种新颖的吸附机制,该机制是在将近饱和的Cl-Si(100)-(2x1)暴露于Cl2的通量时访问的,由此,近饱和表面的悬空键介导了Cl吸附物向非平衡吸附的插入网站。由于能量限制以及缺乏可用的和更有利的吸附位,吸附剂被动力学地捕获在这些位点内。插入的Cl吸附物迫使表面在高温下沿着新的蚀刻路径​​发展,从而导致形成二聚体空位,而没有归因于卤素蚀刻工艺的常规Si再生长特征。在700处调查了此过程。 825 K,然后从适当的速率方程式分析中提取反应机理。

著录项

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    Butera Robert E.;

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  • 年度 2010
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  • 原文格式 PDF
  • 正文语种 {"code":"en","name":"English","id":9}
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