Manufacturing method of build-up high density printed curcuit board

摘要

A build-up high-density printed circuit board is provided to prevent electrical disconnection and short circuit due to mechanical and physical shocks by forming a copper wiring in an inside of an insulating layer instead of the outside of the insulating layer. A surface process is performed on both sides of an aluminum foil by using zincate. An electrolytic strike copper-plating layer(130) is formed on both sides of the zincate. A core is manufactured by forming a circuit pattern through a copper-plating resist coating process, an exposure process, a developing process, and a pattern-plating process. A copper-plating resist is removed. A strike copper-plating layer except for the circuit pattern of the core is removed. A substrate(400) is laminated by an insulating adhesive layer(300) in order to direct a pair of cores to the inside of the circuit pattern at both sides of a build-up internal layer. The aluminum foil and the zincate are removed from the substrate. A via hole is formed at a desired part between the build-up internal layer and the circuit pattern by performing a laser drilling process. A copper-plating resist is coated on both sides of the substrate. An exposure process and a developing process are performed to open only a via hole part. A copper-plating process for the via hole is performed. The copper plating resist is separated. A buried part of the circuit pattern is coated with a solder resist ink. A surface process for an exposed part of the circuit is performed.