Method of manufacturing carrier board and method of manufacturing buried printed curcuit board using the carrier

摘要

According to the invention, the step of preparing a copper foil layer, the step of placing the release paper cut smaller than the size of the copper foil layer on the copper foil layer and the temporary bonding layer of a larger size than the release paper is bonded along the edge of the copper foil layer with the release paper in between Provided are a carrier substrate and a method of manufacturing a printed circuit board using the same, the method including laminating the laminate. According to the present invention, since the carrier substrate can be easily removed by trimming, separation is easier than that of the conventional metal carrier substrate.;Carrier Substrate, Copper Foil Layer, Release Paper, Temporary Bonding Layer