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Method for laser processing on the opposite sides of thin transparent substrates
Method for laser processing on the opposite sides of thin transparent substrates
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机译:在透明的薄基板的相对面上进行激光加工的方法
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摘要
A method is described for simultaneously writing patterns in thin films of material coated on the opposite sides of thin glass or plastic substrates 11 by direct write, laser ablation. The substrates are fully or partially transparent to the laser radiation used and in addition the surfaces of the substrates are not flat. Different registered patterns are applied at the same time to opposite sides of the substrates.
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