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WAFER ALIGNMENT DEVICE, AND WAFER CONVEYANCE DEVICE USING THE SAME

机译:晶圆对准设备,以及使用该晶圆对准设备的晶圆传送设备

摘要

PROBLEM TO BE SOLVED: To provide a wafer alignment device that detects an edge of a wafer with high precision by removing influence of reflected light from the wafer, and to provide a wafer conveyance device using the same.;SOLUTION: The wafer alignment device including a rotating mechanism system which chucks the wafer and rotates it, a detection system which includes an optical sensor having a light projection unit for illuminating the edge of the wafer with light and a light reception unit for receiving the light, and monitors and detects the edge of the wafer, and a control system which outputs a signal for correcting the direction and eccentricity of the wafer according to the quantity of light obtained by the detection system is provided with a slit for suppressing spreading of the light between the light projection unit and light reception unit.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种晶片对准装置,其通过去除来自晶片的反射光的影响来高精度地检测晶片的边缘,并提供一种使用该晶片对准装置的晶片输送装置。旋转机构系统,其夹持晶片并使晶片旋转,该检测系统包括光学传感器,该光学传感器具有用于以光照射晶片边缘的光投射单元和用于接收光的光接收单元,并监视和检测边缘另外,在控制系统上设置有狭缝,该狭缝用于抑制光投射单元与光之间的扩散,该控制系统根据检测系统得到的光量输出用于校正晶片的方向和偏心率的信号。接收单元。版权所有:(C)2010,JPO&INPIT

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