首页> 外国专利> In the alignment device which turns notch or orihura of the alignment mannered null semiconductor wafer of the alignment device of the wafer,

In the alignment device which turns notch or orihura of the alignment mannered null semiconductor wafer of the alignment device of the wafer,

机译:在使晶片的对准装置的对准取向的空半导体晶片的切口或折痕对准的对准装置中,

摘要

PROBLEM TO BE SOLVED: To make an aligner compact and shorten alignment time in the aligner that detects a notch in a wafer and performs angular alignment.;SOLUTION: The aligner for wafer includes: a wafer placement portion 7 to place a semiconductor wafer 3 wherein an ID 11 marked at the predetermined position to a notch or an orientation flat 15 is marked on its front or rear surface; a rotation mechanism for rotating the wafer placement portion 7; a rotating position detection means to detect the rotating position of the wafer placement portion 7, and an ID reader 10 to read the ID 11. The rotating position of the wafer placement portion 7 where the ID reader 10 reads the ID 11 is acquired from the rotating position detection means, and the notch or the orientation flat 15 is rotated up to an optional position according to the positional relationship between the in-advance stored ID 11 and the notch or the orientation flat 15.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:使对准器紧凑并且缩短在对准器中的对准时间,该对准器检测晶片中的凹口并执行角度对准。解决方案:晶片对准器包括:晶片放置部分7,用于放置半导体晶片3,其中在其预定位置上刻有缺口或定向平面15的ID 11被标记在其前表面或后表面上。用于使晶片载置部7旋转的旋转机构。旋转位置检测装置检测晶片放置部分7的旋转位置,ID读取器10读取ID11。ID读取器10读取ID 11的晶片放置部分7的旋转位置是从晶片获取。旋转位置检测装置,并且根据预先存储的ID 11和切口或定向板15之间的位置关系,将切口或定向板15旋转到可选位置。版权所有:(C)2010,日本特许厅

著录项

  • 公开/公告号JP5115363B2

    专利类型

  • 公开/公告日2013-01-09

    原文格式PDF

  • 申请/专利权人 株式会社安川電機;

    申请/专利号JP20080173003

  • 发明设计人 吉野 圭介;萩尾 光昭;

    申请日2008-07-02

  • 分类号H01L21/68;

  • 国家 JP

  • 入库时间 2022-08-21 16:53:25

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