首页> 外国专利> Semiconductor wafer alignment device, has a rotating plate with supports on its outer edge on which the edges or edge regions of the wafer are supported during wafer rotation and alignment

Semiconductor wafer alignment device, has a rotating plate with supports on its outer edge on which the edges or edge regions of the wafer are supported during wafer rotation and alignment

机译:半导体晶片对准装置具有在其外边缘上具有支撑件的旋转板,在晶片旋转和对准期间,晶片的边缘或边缘区域被支撑在其上

摘要

Device for aligning a wafer has a rotating plate (1) that supports the wafer and which can be rotated about its rotation axis (M) for the purpose of aligning the wafer. The rotating plate is designed so that the wafer is only supported on its edge or edge region. An independent claim is made for a handling device for processing a wafer, especially a marking device for marking or writing on the wafer using a laser beam. The device has a misalignment detection device that generates displacement signal or displacement information.
机译:用于对准晶片的装置具有旋转板(1),该旋转板支撑晶片并且可以绕其旋转轴线(M)旋转以便对准晶片。旋转板被设计成使得晶片仅被支撑在其边缘或边缘区域上。独立地提出了用于处理晶片的处理装置,特别是用于使用激光束在晶片上进行标记或书写的标记装置。该设备具有产生位移信号或位移信息的失准检测设备。

著录项

  • 公开/公告号DE202004011907U1

    专利类型

  • 公开/公告日2004-12-02

    原文格式PDF

  • 申请/专利权人 INNOLAS GMBH;

    申请/专利号DE20042011907U

  • 发明设计人

    申请日2004-07-30

  • 分类号H01L21/68;G01B11/27;H01L21/66;H01L23/544;

  • 国家 DE

  • 入库时间 2022-08-21 22:00:32

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