POLISHING PAD FOR POLISHING A SEMICONDUCTOR WAFER CAPABLE OF ELIMINATING EDGE ROLL-OFF IN THE EDGE REGION OF THE SEMICONDUCTOR WAFER AND A SEMICONDUCTOR WAFER POLISHING METHOD

摘要

PURPOSE: A polishing pad for polishing a semiconductor wafer and a semiconductor wafer polishing method are provided to increase the planarity of the rear surface and/or front surface of the semiconductor wafer, thereby providing the good quality of the semiconductor wafer.;CONSTITUTION: A polishing pad comprises an abrasive layer, a layer comprised of rigid plastic, and a non-woven fabric compliant layer. The layers described above are combined each other by an adhesive layer. The layer comprised of the rigid plastic includes polycarbonate. The compliant layer includes polyester fiber. The abrasive layer includes an oxide particle or hard material particle comprised of cerium, aluminum, silicon or zirconium.;COPYRIGHT KIPO 2012