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Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI

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1.Enhancements in resizing single crystalline silicon wafers up to 450 mm by using thermal laser separation

机译：通过使用热激光分离增强最大尺寸为450 mm的单晶硅晶片的尺寸
- 作者：Koitzsch M.;Lewke D.;Schellenberger M.;Pfitzner L.;Ryssel H.;Zuhlke H.-U.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
2.Modifying mask blank manufacturing to incorporate cleaning and deposition experimentation

机译：修改掩膜毛坯制造以结合清洁和沉积实验
- 作者：Godwin Milton;Rudack Anne
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
3.TiN metal hardmask etch residue removal with mask pullback and complete mask removal for Cu dual damascene device

机译：TiN金属硬掩模蚀刻残留物去除，具有掩模拉回功能，可完全去除铜双镶嵌装置的掩模
- 作者：Cui Hua
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
4.RTO process monitoring with inline non-contact technique

机译：采用在线非接触技术的RTO过程监控
- 作者：Pic Nicolas;Paire Emmanuel;Grosjean Catherine;Pellegrin Guillaume;Belfy Arnaud;Laurens Patrice
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
5.Measurement strategy for dielectric ultra-thin film characterization by vacuum ultra-violet reflectometry

机译：真空紫外反射法表征介电超薄膜的测量策略
- 作者：Gumprecht T.;Roeder G.;Schellenberger M.;Pfitzner L.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
6.Measuring hydrochloric acid and ammonium hydroxide permeation in bulk chemical distribution

机译：测量散装化学品中盐酸和氢氧化铵的渗透率
- 作者：Moon Sung In;Caulfield Mark;Extrand C. W.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
7.Wafer characterization via sub-nanosecond time-correlated single photon counting

机译：通过亚纳秒时间相关的单光子计数进行晶圆表征
- 作者：Buschmann V.;Kapusta P.;Koberling F.;Ortmann U.;Siebert T.;Fore S.;Erdmann R.;Knigge A.;Roczen M.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
8.Growing the representation of women in leadership: A business imperative IBM Microelectronics' PowerUp initiative

机译：在领导层中增加女性代表人数：一项必须执行的业务IBM Microelectronics的PowerUp计划
- 作者：Cretekos Mary;Beilstein Lisa;Dunbar Christine;Hall Kathleen Yanarella;Hall Dawn;Whelehan Scott;Leduc Raymond;McClure Scott R.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
9.A predictive maintenance system based on regularization methods for ion-implantation

机译：基于正则化方法的离子注入预测维护系统
- 作者：Susto Gian Antonio;Schirru Andrea;Pampuri Simone;Beghi Alessandro
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
10.Development of CMP pad using an unpatterned surface inspection system

机译：使用无图案表面检测系统开发CMP垫
- 作者：Cheng C. Y.;Peng S. N.;Chen S. C.;Yang Larry;Hu Debbie;Lin Steve
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
11.A novel approach to optical wafer pre-alignment using innovative ranging edge detectors

机译：使用创新的测距边缘检测器进行光学晶圆预对准的新方法
- 作者：Jerman Thomas;Priewald Robin H.;Leitgeb Walter
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
12.Lithography challenges and solutions for MEMS/LED/ABS applications

机译：MEMS / LED / ABS应用的光刻挑战和解决方案
- 作者：Khorram Hamid R.;Fukui Jumpei;Hagiwara Susumu;Mizoroke Shigeo;Osanai Makoto;Onuki Tetsuji;Berghof Volker
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
13.Scatterometry measurement for SiGe AEI sigma-shaped gate structures of 28nm technology

机译：28nm SiGe AEI sigma形栅极结构的散射测量
- 作者：Wang Yu-Wen;Yeh Autumn;Lin Pao-Chung;Chien Chin-Cheng;Lin Ching-Hung Bert;Xu Zhi-Qing James;Cheng Chao-Yu Harvey;Yoo Sungchul;Lin Jason;Mihardja Lanny;Perry-Sullivan Catherine
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
14.Tribological, thermal, and kinetic attributes of 300 vs. 450 mm chemical mechanical planarization processes

机译：300与450 mm化学机械平面化工艺的摩擦学，热学和动力学属性
- 作者：Jiao Yubo;Liao Xiaoyan;Wu Changhong;Zhuang Yun;Sampurno Yasa;Philipossian Ara;Zhuang Yun;Theng Siannie;Sampurno Yasa;Philipossian Ara;Goldstein Michael
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
15.Green mode: Equipment interface to reduce semiconductor sub-fab utility consumption

机译：绿色模式：设备接口可减少半导体分厂的公用事业消耗
- 作者：Pierce Adrienne;Parks Val
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
16.Rules of automation for 200mm semiconductor manufacturing environment

机译：200mm半导体制造环境的自动化规则
- 作者：Heinrich Harald;Deutschlander Arthur
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
17.Improving eco-efficiency via elimination of greenhouse gases from semiconductor dry cleaning processes

机译：通过消除半导体干洗过程中的温室气体来提高生态效率
- 作者：Oh C. H.;Ko S. J.;Shin D. K.;Jeong Y. Y.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
18.IMPROVE simulation tool: Integrating heterogeneous simulation modules for semiconductor manufacturing processes

机译：IMPROVE仿真工具：集成用于半导体制造过程的异构仿真模块
- 作者：Almeida Nuno;Pires Joao;Sora David
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
19.Real-time, continuous large particle monitoring for CMP slurry quality control

机译：实时，连续的大颗粒监控，用于CMP浆料质量控制
- 作者：Kim Andy;Murai Koh;Parkin Michael;Mavliev Rashid
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
20.A comparison of data mining methods for yield modeling, chamber matching and virtual metrology applications

机译：用于产量建模，腔室匹配和虚拟计量应用的数据挖掘方法的比较
- 作者：Sharma Deepak;Armer Helen;Moyne James
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
21.Analysis of an effect of perturbations in SWHM and illuminating optical scheme parameters on an aerial image

机译：分析SWHM中的扰动和照明光学方案参数对航空影像的影响
- 作者：Borisov M. V.;Chelyubeev D. A.;Chernik V. V.;Gavrikov A. A.;Knyazkov D. Yu.;Mikheev P. A.;Rakhovskiy V. I.;Shamaev A. S.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
22.Modeling and analysis of integrated planning of production and engineering process improvement

机译：生产和工程流程改进集成计划的建模和分析
- 作者：Kim Sukgon;Uzsoy Reha
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
23.Trench geometry and resist profiles from modeling of polarized optical spectra

机译：通过偏振光谱建模获得沟槽几何形状和抗蚀剂轮廓
- 作者：Heider Franz;Kayser Christian;Millonig Hans;Sundaraneedi Samrat A.;Roberts Jeffrey W.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
24.Optical metrology of thickness and indium composition of epitaxial InxGa1−xAs layers on Si substrates

机译：硅衬底上外延InxGa1-xAs层的厚度和铟组成的光学计量
- 作者：Waldron Niamh;Orzali Tommaso;Caymax Matty;Horiguchi Naoto;Jin Youseung;Park Tae Hyun;Jiang Zhiming;Han Sang Hyun
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
25.Automated TEM metrology characterization of Si devices

机译：硅器件的自动TEM计量学表征
- 作者：Strauss M.;Genc A.;Dutrow G.;Horspool D. N.;Dworkin L. A.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
26.Framework for integration of virtual metrology and predictive maintenance

机译：虚拟计量与预测性维护集成的框架
- 作者：Roeder Georg;Mattes Andreas;Pfeffer Markus;Schellenberger Martin;Pfitzner Lothar;Knapp Alexander;Muhlberger Heribert;Kyek Andreas;Lenz Benjamin;Frisch Markus;Bichlmeier Josef;Leditzky Gunter;Lind Erich;Zoia Silvia;Fazio Giuseppe
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
27.Improved sustainability of an existing fab operation through reduced energy consumption

机译：通过降低能耗来提高现有晶圆厂运营的可持续性
- 作者：Yeaman Don;Rogerson Ron
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
28.Leveraging Advanced Process Control (APC) technology in developing Predictive Maintenance (PdM) systems

机译：利用高级过程控制（APC）技术开发预测性维护（PdM）系统
- 作者：Moyne James;Ward Nick;Hawkins Parris
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
29.Influences of etcher chamber condition on critical-dimension shifts in advanced floating gate etching process

机译：先进的浮栅刻蚀工艺中刻蚀腔条件对临界尺寸偏移的影响
- 作者：Chang Sheng-Yuan;Chen Yu-Chung;Wei An Chyi;Lee Hong-Ji;Lian Nan-Tzu;Yang Tahone;Chen Kuang-Chao;Lu Chih-Yuan
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
30.The analysis of device performance on a different shallow trench isolation (STI) liner scheme

机译：在不同的浅沟槽隔离（STI）衬垫方案上的器件性能分析
- 作者：Wang Sun Jong;Lee Jun Sup;Kim Sung Hun;Kang Sung Gun;Roh Yong-han
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
31.TSV RF de-embedding method and modeling for 3DIC

机译：用于3DIC的TSV RF去嵌入方法和建模
- 作者：Yen Hsiao-Tsung;Lin Yu-ling;Hu Clark;Jan S. B.;Hsieh Chi-Chun;Chen M. F.;Kuo Chin-Wei;Chen Ho-Hsiang;Jeng Min-Chie
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
32.New polymerizing chemistries for through-silicon via etching

机译：用于通过硅刻蚀的新型聚合化学方法
- 作者：Nicoll William;Eisenbraun Eric;Dussarrat Christian;Gupta Rahul;Anderson Curtis
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
33.E-beam inspection for detection of sub-design rule physical defects

机译：电子束检查，用于检测子设计规则的物理缺陷
- 作者：Patterson Oliver D.;Lee Julie;Lei Chris;Salvador Dave
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
34.Photo cell monitoring inspection methodology employing a complementary strategy of advanced darkfield and high sensitivity brightfield inspection tools

机译：采用先进的暗场和高灵敏度明场检查工具的互补策略的光电池监控检查方法
- 作者：Syu Jyn Hao;Lin Chen Chiz;Chiang P Y;Chen Nagus;Yang Henry;Huang Eros;Cheng Harvey;Lin Mahatma;Chen Kan;Lang Jun
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
35.Use of 22 nm Litho SEM non-visual defect data as a process quality indicator

机译：使用22 nm光刻SEM非可视缺陷数据作为过程质量指标
- 作者：Boye Carol A.;Penny Christopher J.;Connors Joe;Boyles Donna;Janicki Cezary;Ghaskadvi Rajesh;Hahn Roland
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
36.Defect inspection challenges and solutions for ultra-thin SOI

机译：缺陷检查挑战和超薄SOI解决方案
- 作者：Brun Roland;Moulin Cecile;Schwarzenbach Walter;Bast Gerhard;Aristov Victor;Belyaev Alexander
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
37.Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes

机译：用于32nm和22nm技术节点的Cu CMP后清洗工艺评估
- 作者：Tseng Wei-Tsu;Canaperi Donald;Ticknor Adam;Devarapalli Vamsi;Tai Leo;Economikos Laertis;MacDougal James;Bunke Christine;Angyal Matthew;Muncy Jennifer;Chen Xiaomeng;Zhang John;Fang Qiang;Zheng Jianping
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
38.Improving yield learning by electrical fault inspection

机译：通过电气故障检查提高良率学习
- 作者：Block Jeffrey A.;Sakamoto Paul;Lundquist Ted
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
39.Identifying systematic critical features using silicon diagnosis data

机译：使用硅诊断数据识别系统关键特征
- 作者：Schuermyer Chris;Malik Shobhit;Herrmann Thomas
- 会议名称：《》 | 2012年
40.Using selective voltage binning to maximize yield

机译：使用选择性电压装仓以最大化产量
- 作者：Lichtensteiger Susan;Bickford Jeanne
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
41.Optimal tuning of epitaxy pyrometers

机译：外延高温计的优化调整
- 作者：Susto Gian Antonio;Pampuri Simone;Schirru Andrea;Beghi Alessandro
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
42.Efficient FDC based on hierarchical tool condition monitoring scheme

机译：基于分层工具状态监控方案的高效FDC
- 作者：Blue Jakey;Roussy Agnes;Thieullen Alexis;Pinaton Jacques
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
43.Predictive sampling approach to dynamically optimize defect density control operations

机译：预测性采样方法可动态优化缺陷密度控制操作
- 作者：Pfeffer M.;Oechsner R.;Pfitzner L.;Eckert S.;Hartmann A.;Gold H.;Biebl G.;Kaspar J.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
44.High-k/metal gates in leading edge silicon devices

机译：前沿硅器件中的高k /金属栅
- 作者：James Dick
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
45.The hidden productivity: How to get more out of your equipment

机译：隐藏的生产力：如何充分利用设备
- 作者：Kalir Adar;Nahum Yair;Sharon Andy
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
46.Experimental investigation and manufacturing solution of the rapid thermal process induced overlay residue

机译：快速热处理过程中产生的残留物的实验研究和制造解决方案
- 作者：Tong Weihua;Kim Really;Krishnan Bharat;Kim Sung;Vatel Olivier;Liu Xuli;Huang Lei;Suresh K.;Tan Miowchin;Srinivasan Vish;Benyon Peter
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
47.In-line metrology capability for epitaxial multi-stack SiGe layers

机译：外延多层SiGe层的在线计量能力
- 作者：Le Cunff D.;Couvrat S.;Abbate F.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
48.Humidity rise after purge in micro-environments

机译：微环境净化后湿度上升
- 作者：Moon Sung In;Extrand C. W.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
49.Properties of isolation liner and electrical characteristics of high aspect ratio TSV in 3D stacking technology

机译：3D堆叠技术中隔离衬层的特性和高纵横比TSV的电特性
- 作者：Jung Deok Young;Moon Kwang-Jin;Park Byung-Lyul;Choi Gilheyun;Kang Ho-Kyu;Chung Chilhee;Jung Deok Young;Rho Yonghan
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
50.Laser micro-scale thermal wave characterization of heat transport processes in modern semiconductor structures and devices

机译：激光微尺度热波表征现代半导体结构和器件中的热传输过程
- 作者：Kozlov V. A.;Glazov A. L.;Muratikov K. L.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
51.Design based classification for process window defect characterization of BEOL ADI layers

机译：基于设计的BEOL ADI层工艺窗口缺陷特征分类
- 作者：Kim Young Su;Kwon Young Hun;Kim Ki Ho;Hwang Tae Woong;Babulnath Raghav;Yu Colin;Desai Paresh
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
52.A self-aligned double patterning technology using TiN as the sidewall spacer

机译：使用TiN作为侧壁间隔物的自对准双图案化技术
- 作者：Chiu Yuan-Chieh;Yu Shu-Sheng;Hsu Fang-Hao;Lee Hong-Ji;Lian Nan-Tzu;Yang Tahone;Chen Kuang-Chao;Lu Chih-Yuan
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
53.Enhanced process control of pitch split double patterning by use of CD-SEM critical dimension uniformity and local overlay metrics

机译：通过使用CD-SEM临界尺寸均匀性和局部覆盖量度，增强了间距分割双图案的工艺控制
- 作者：Halle Scott D.;Hotta Shoji;Koay Chiew-seng;Chen Shyng-Tsong;Kato Takeshi;Yamaguchi Atsuko;Colburn Matthew
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
54.Detection, binning, and analysis of defects in a GaN-on-Si process for High Brightness Light Emitting Diode's

机译：用于高亮度发光二极管的GaN-on-Si工艺中缺陷的检测，分级和分析
- 作者：Halder Sandip;Miller Andy;Osman Haris;Dutta Barun;Mani Antonio;Jones Christopher;McCance Syd;Burkeen Frank
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
55.Detecting arcing events in semiconductor manufacturing equipment

机译：检测半导体制造设备中的电弧事件
- 作者：Singlevich Scott;Subrahmanyam Kommisetti V R
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
56.Optimal wafer site selection using forward selection component analysis

机译：使用正向选择成分分析的最佳晶圆选址
- 作者：Prakash Pks;Honari B.;Johnston A.;McLoone S. F.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
57.CMOS-integrated geometrically tunable optical filter

机译：CMOS集成几何可调谐滤光片
- 作者：Lerose Damiana;Gabler Daniel;Junger Stephan
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
58.New method of WLCSP for process optimization and reliability prediction

机译：WLCSP的过程优化和可靠性预测的新方法
- 作者：Ku Chin-Yu;Huang Wei-Chi;Lien Young-Chang;Yew Ming-Chih;Lin Po-Yao;Yu Hsiu-Mei
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
59.Advanced metrology and gas purifier yield improvement

机译：先进的计量和气体净化器产量提高
- 作者：Srivastava Abneesh
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
60.The study of leakage current performance improvement in high voltage technology

机译：高压技术中漏电流性能改进的研究
- 作者：Chen M. H.;Ni C. T.;Liu R. H.;Chen Y. L.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
61.Maintenance pooling to maximize fab uptime

机译：维护池可最大化工厂正常运行时间
- 作者：Czerniak Mike;Ifould Alan;Mooney Michael;Maiorana Angelo
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
62.Carbonized surface curing for etch-back process

机译：碳化表面固化，用于回蚀工艺
- 作者：Jang Sungjin;Kim In-cheol;Lee Kyu-yeol;Lee Soo-cheol;Cho In-soo;Choi Byoung-deog
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
63.Decoupling capacitor modeling and characterization for power supply noise in 3D systems

机译：3D系统中电源噪声的去耦电容器建模和表征
- 作者：Xu Zheng;Putnam Christopher;Gu Xiaoxiong;Scheuermann Michael;Rose Kenneth;Webb Buckwell;Knickerbocker John;Lu Jian-Qiang
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
64.A memory volume diagnostics methodology to facilitate production yield learning with embedded memories

机译：一种内存量诊断方法，可通过嵌入式存储器促进生产良率的学习
- 作者：Farrugia Ruth;Lecomte Stephane;Zheng Tammy Dong Lei;Giroud Christophe;Garait Florent;Faehn Eric;Suzor Christophe;Kekare Sagar A.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
65.Automated optical inspection for die prep

机译：模具准备的自动光学检查
- 作者：Mei Xue;Patel Nital S.;Bicen Baris;Khalsa Simranjit
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
66.Bevel RIE application to reduce defectivity in copper BEOL processing

机译：斜面RIE应用可减少BEOL铜加工中的缺陷
- 作者：Bunke Christine;Houghton Thomas;Bandy Kenneth;Stojakovic George;Fang Grace
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
67.Potentials of condition based monitoring in semiconductor manufacturing

机译：基于状态监测的半导体制造潜力
- 作者：Cholette Michael E.;Djurdjanovic Dragan;Rasberry John D.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
68.MSC-clustering and forward stepwise regression for virtual metrology in highly correlated input spaces

机译：在高度相关的输入空间中进行虚拟计量的MSC群集和正向逐步回归
- 作者：Prakash Pks;Schirru Andrea;Hung Peter;McLoone Sean
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
69.Innovative approach to identify location of AMC source in cleanroom by inverse Computational Fluid Dynamics modeling

机译：通过逆计算流体动力学建模来识别AMC源在洁净室中位置的创新方法
- 作者：Hwang James J. J.;Chou Kevin;Yang Chi-Ming;Lin John;Chuang Arthur T. S.;Tsao J. M.;Chen C. F.;Hu S. C.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
70.Managing variability within wafertest production by combining lean and six sigma

机译：通过结合精益和六个西格玛来管理晶圆测试生产中的可变性
- 作者：Eberts Dietrich;Rottnick Ralph;Schneider Germar;Keil Sophia;Lasch Rainer;Buhmann Oliver
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
71.Analytic modeling of AC response to FET-level elements for CLY optimization

机译：用于CLY优化的AC对FET级元件的响应的解析模型
- 作者：Karve Gauri;Logan Ron;Greene Brian;Winslow Jonathan
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
72.Optimizing product yield using manufacturing defect weights

机译：利用制造缺陷权重优化产品良率
- 作者：Bickford Jeanne Paulette;Hibbeler Jason D.;Peyer Sven;Mueller Dirk;Kumar Vasanth S.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
73.An integrated advanced process control on RTP gate oxide thickness and feed-forward implant compensation in mass production

机译：大规模生产中RTP栅氧化层厚度和前馈注入补偿的集成高级过程控制
- 作者：Jian Zhang;Xiang Liu Shi;Ming Lei;Yun Ling Syau;Chou Lim Ming;Suresh K.;Chin Tan Miow;Srinivasan Vish;Benyon Peter
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
74.A comprehensive approach to process control

机译：全面的过程控制方法
- 作者：van Roijen R.;Sinn C.;Afoh W.;Hwang E.;Scarano J.;Rangarajan S.;Brown J. J.;Brennan W.;Conti S.;Keyser R.
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
75.E-beam inspection for combination use of defect detection and CD measurement

机译：电子束检查，结合使用缺陷检测和CD测量
- 作者：Boye Carol;Standeart Theodorus;Wang Fei;Lei Shuen Cheng;Chen Shih-tsung;Jau Jack;Tomlison Derek
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
76.A failure model of heating filaments in epitaxial growth tools

机译：外延生长工具中加热丝的失效模型
- 作者：Hui Keung;Mou Jason
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
77.Evaluation of fabrication process for a novel Chip-to-Wafer (C2W) 3D integration approach using an alignment template

机译：使用对准模板评估新型晶片对晶片（C2W）3D集成方法的制造工艺
- 作者：Zhang Dingyou;Lu Jian-Qiang
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
78.Industry approach to the conflict minerals legislation

机译：冲突矿产立法的行业方法
- 作者：Connors Jared
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
79.Operator-free exception measurement logistics for a highly automated 200mm semiconductor manufacturing environment

机译：高度自动化的200mm半导体制造环境的免操作异常测量物流
- 作者：Bannert Andrea;Heinlein Frank;Adam Matthias;Manja Kay
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
80.Assessing the impact of the 450mm wafer size transition on manufacturing facility automated material handling systems

机译：评估450mm晶圆尺寸过渡对制造工厂自动化材料处理系统的影响
- 作者：Hennessy Larry
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年
81.Enabling collaborative solutions across the semiconductor manufacturing ecosystem

机译：在整个半导体制造生态系统中实现协作解决方案
- 作者：Yang Jiting;Weber Charles;Gabella Patricia
- 会议名称：《Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI》 | 2012年