Production manner of semiconductor chip, production manner of semiconductor equipment, production manner of circuit substrate and production manner of electronic equipment

摘要

P To provide methods of manufacturing a semiconductor chip and the like having a vertical conduction structure of high aspect ratio/high reliability, a semiconductor device, a circuit board and electronic equipment. PSOLUTION: The method of manufacturing has a process to form a foregoing hole by diagonally radiating a laser beam ON a crystalline substrate composed of a silicon substrate whose plane direction is a (100) surface; and process to form a through-hole by performing anisotropic etching by a KOH solution of water or an organic alkali etching liquid to expand the foregoing hole. Further and the method has a process to form an insulation film ON the inner wall of the through-hole; and process to form a conductive material in the through-hole whose inner wall is insulated and to form a metal bump which brings one surface of the crystalline substrate and the other surface electrically into a conducting state. PCOPYRIGHT: (C)2007 and JPO& INPIT