首页> 外国专利> Production manner of the semiconductor film, production manner of semiconductor equipment and production manner of the electronic equipment, the semiconductor film, the 1st process which forms

Production manner of the semiconductor film, production manner of semiconductor equipment and production manner of the electronic equipment, the semiconductor film, the 1st process which forms

机译:半导体膜的制造方式,半导体设备的制造方式以及电子设备的制造方式,半导体膜,形成的第一工序

摘要

PPROBLEM TO BE SOLVED: To provide a manufacturing method of a silicon carbide film (semiconductor film) improved in characteristics. PSOLUTION: The manufacturing method of the semiconductor film includes: a first process of forming a first silicon carbide film 3 on a silicon film by supplying a carbon source gas onto the first silicon film S1; a second process of forming a second silicon film 5 on the first carbon silicon film; a third process of irradiating the second silicon film with laser beams; and a fourth process of forming a second silicon carbide film by supplying a carbon source gas and a silicon source gas onto the first silicon carbide film after the third process. By this method, the first silicon carbide film 3 can be reformed through the irradiation of the laser beams to improve characteristics of the second silicon film grown on the film. PCOPYRIGHT: (C)2009,JPO&INPIT
机译:

要解决的问题:提供一种特性改善的碳化硅膜(半导体膜)的制造方法。

解决方案:半导体膜的制造方法包括:通过将碳源气体供应到第一硅膜S1上在硅膜上形成第一碳化硅膜3的第一工艺;在第一碳硅膜上形成第二硅膜5的第二工艺;第三工序是对第二硅膜照射激光。第四步骤,通过在第三步骤之后将碳源气体和硅源气体供应到第一碳化硅膜上来形成第二碳化硅膜。通过这种方法,可以通过照射激光束来重整第一碳化硅膜3,以改善在膜上生长的第二硅膜的特性。

版权:(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP5157026B2

    专利类型

  • 公开/公告日2013-03-06

    原文格式PDF

  • 申请/专利权人 セイコーエプソン株式会社;

    申请/专利号JP20080025632

  • 发明设计人 島田 浩行;

    申请日2008-02-05

  • 分类号H01L21/205;H01L21/20;H01L29/161;H01L29/12;H01L29/78;H01L21/336;H01L29/47;H01L29/872;H01L21/329;

  • 国家 JP

  • 入库时间 2022-08-21 16:53:28

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号