Being production manner of stacked tip/chip semiconductor equipment, implemental manner of stacked tip/chip semiconductor equipment, and production manner

摘要

PROBLEM TO BE SOLVED: To provide good rewiring that has one end connected with a chip and the other end exposed to the surface of an insulating resin covering the chip in a stack chip semiconductor device.;SOLUTION: A semiconductor chip is sealed by an insulating resin so that the wiring surface of the chip is exposed, rewiring that has one end connected with the wiring surface of the semiconductor chip and the other end extending to a position on the outside of the outer edge of the semiconductor chip is formed on the wiring surface side of the semiconductor chip in a sealed body thus obtained, a plurality of sealed bodies are stacked so that the positions of the semiconductor chips overlap in the stacking direction, and then a stacked body thus obtained is cut between the position of the outer edge of the semiconductor chip and the other end of the rewiring.;COPYRIGHT: (C)2012,JPO&INPIT