Production manner of the substrate for semiconductor equipment and the substrate for semiconductor equipment, production manner and semiconductor equipment null of the semiconductor equipment which uses the substrate for semiconductor equipment

摘要

PROBLEM TO BE SOLVED: To provide a plastic substrate having no cracks on end surfaces of a substrate, having an excellent function, showing good appearance and having high reliability. ;SOLUTION: This plastic substrate is laid out with a single or a plurality of circuit substrates 10 made of a resin plate in parallel with at least one frame 11 made of a resin plate with slits having a predetermined width. The circuit substrate 10 is supported by the frame 11 by using joints 10a provided on four corners of the circuit substrate 10. A metal plate 12 is provided on the whole interior of the resin plates from the circuit substrate 10 to the joints 10a to the frame 11 expect for a through hole range on the outer periphery of the circuit substrate 10.;COPYRIGHT: (C)1997,JPO