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Being the vapor phase growth device which the vapor phase grows the silicon monocrystal

机译:作为气相生长单晶硅的气相生长装置

摘要

PROBLEM TO BE SOLVED: To provide a vapor phase growing apparatus which can make a flow channel of material gas flowing on a silicon single crystal substrate more uniformly to assure a good film thickness distribution, and to provide a method of manufacturing an epitaxial wafer using the same.;SOLUTION: The vapor phase growing apparatus 1 is constituted as a sheet type. The material gas G is guided from a gas inlet 21 into a reaction vessel 2. A bank member 23 is disposed around a susceptor 12. There is provided a mechanism that the material gas G from the gas inlet 21 hits on the outer peripheral surface 23b of the bank member 23 and rides on the upper surface 23a side, and then flows along the main surface of the single crystal substrate W installed in the susceptor 12. An upper lining member 4 is disposed in the shape facing the bank member 23 above the bank member 23. A gas introducing gap 60 is formed between the bank member 23 and the upper lining member 4. In the vapor phase growing apparatus 1, the forming length of the direction along the horizontal reference line HSL of the gas introducing gap 60 is reduced as it keeps away from the horizontal reference line HSL or the upper lining member 4 is regulated in size so as to become constant also at any position.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种气相生长设备,其可以使在硅单晶衬底上流动的原料气体的流道更均匀,以确保良好的膜厚分布,并提供一种使用该方法制造外延晶片的方法。解决方案:气相生长设备1被构造为片状。原料气体G从气体入口21被引导到反应容器2中。在基座12的周围配置有堤坝部件23。设置有使来自气体入口21的原料气体G撞击外周面23b的机构。隔壁部件23的上方并沿上表面23a侧骑行,然后沿着安装在基座12中的单晶基板W​​的主表面流动。上衬部件4以与隔壁部件23相对的形状配置在上方。隔壁部件23。在隔壁部件23与上衬里部件4之间形成有气体导入间隙60。在气相生长装置1中,沿气体导入间隙60的水平基准线HSL的方向的形成长度为:缩小尺寸,因为它远离水平参考线HSL或调整了上衬部件4的大小,以便在任何位置都保持不变。;版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4379585B2

    专利类型

  • 公开/公告日2009-12-09

    原文格式PDF

  • 申请/专利权人 信越半導体株式会社;

    申请/专利号JP20030419201

  • 发明设计人 山田 透;

    申请日2003-12-17

  • 分类号H01L21/205;C23C16/24;

  • 国家 JP

  • 入库时间 2022-08-21 18:56:52

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