Post-routing power supply modification for an integrated circuit

摘要

A technique for generating the layout of an integrated circuit 2 places the standard cells 8, 10, 12 in position and provides power rail conductors 38, 40, 42 formed in a second metal layer overlying power connection conductors 14 to 30 formed in a first metal layer via which the power is supplied to the standard cells. Routing connection conductors 32, 34, 36 are added in the first metal layer and are permitted to pass through gaps between the power connection conductors of the first metal layer and underneath the power rail conductors of the second metal layer. Once routing has been performed, gaps between the power connection conductors of the first metal layer underlying the power rail conductors and not being used by routing connection conductors are closed so as form interrupted power rail conductors within the first meal layer.