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Integrated circuit die containing particale-filled through-silicon metal vias with reduced thermal expansion
Integrated circuit die containing particale-filled through-silicon metal vias with reduced thermal expansion
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机译:集成电路芯片,包含填充了微粒的硅金属通孔,具有减小的热膨胀
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摘要
A method, apparatus and system with an electrically conductive through hole via of a composite material with a matrix forming a continuous phase and embedded particles, with a different material property than the matrix, forming a dispersed phase, the resulting composite material having a different material property than the matrix.
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