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Method of fabricating a metal gate CMOS with at least a single gate metal and dual gate dielectrics

机译:具有至少单栅金属和双栅电介质的金属栅CMOS的制造方法

摘要

A method of fabricating a complementary metal oxide semiconductor (CMOS) structure including at least one nFET and at least one pFET located on a surface of a semiconductor substrate is provided. In accordance with the present invention, the nFET and the pFET both include at least a single gate metal and the nFET gate stack is engineered to have a gate dielectric stack having no net negative charge and the pFET gate stack is engineered to have a gate dielectric stack having no net positive charge. In particularly, the present invention provides a method of fabricating a CMOS structure in which the nFET gate stack is engineered to include a band edge workfunction and the pFET gate stack is engineered to have a ¼ gap workfunction.
机译:提供一种制造互补金属氧化物半导体(CMOS)结构的方法,该互补金属氧化物半导体(CMOS)结构包括位于半导体衬底的表面上的至少一个nFET和至少一个pFET。根据本发明,nFET和pFET都包括至少一个栅极金属,并且nFET栅极叠层被设计为具有不具有净负电荷的栅极电介质叠层,并且pFET栅极叠层被设计为具有栅极电介质。没有净正电荷的电池组。特别地,本发明提供一种制造CMOS结构的方法,其中,nFET栅叠层被设计为包括带边缘功函数,而pFET栅叠层被设计为具有1/4间隙功函数。

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