首页>
外国专利>
Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package
Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package
展开▼
机译:晶片级芯片规模封装,其制造方法以及包括该晶片级芯片规模封装的半导体芯片模块
展开▼
页面导航
摘要
著录项
相似文献
摘要
Provided are a wafer level chip scale package in which a redistribution process is applied at a wafer level, a manufacturing method thereof, and a semiconductor chip module including the wafer level chip scale package. The wafer level chip scale package includes a semiconductor chip having a bonding pad, a first insulating layer disposed on the semiconductor chip so as to expose the bonding pad, a redistribution line disposed on the exposed bonding pad and the first insulating layer, a sacrificial layer disposed below a redistribution pad of the redistribution line, a second insulating layer disposed on the redistribution line so as to expose the redistribution pad and including a crack inducement hole disposed beside the sacrificial layer, and an external connection terminal attached to the redistribution pad.
展开▼