A SOLDER BUMP BONDIG METHOD, STENCIL. AND SYSTEM

摘要

A method, stencil, and system for forming solder bumps on a substrate having electrical pads formed thereon. The method and system form a photoresist layer on the substrate, pattern the photoresist layer to form photoresist openings aligned with the electrical pads on the first substrate, supply solder balls into the photoresist openings, and connect electrically the electrical pads by heating the solder balls to form the solder bumps. The stencil includes a photoresist layer having a plurality of patterned openings aligned with the electrical pads on the substrate. The openings are dimensioned to accommodate the solder balls.