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Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same
Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same
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机译:焊料泡沫,纳米多孔焊料,芯片封装中的泡沫焊料凸点,组装方法以及包含该焊料的系统
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摘要
A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.
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