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Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps

机译：通过PB的焊料和Au凸块加入的倒装芯片互连系统的热可靠性的提高

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Shinichi Terashima; Tomohiro Uno; Eiji Hashino; Kohei Tatsumi;
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年度 2001
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1. Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps [J] . Shinichi Terashima, Tomohiro Uno, Eiji Hashino Materials transactions . 2001,第5期

机译：无铅焊料和Au凸点结合的倒装芯片互连系统的热可靠性提高
2. Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au [J] . Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing . 2008,第1a2期

机译：Sn和Au连续电镀法制备的Au-20Sn倒装芯片凸点的可靠性评估
3. The thermal cycling reliability of copper pillar solder bump in flip chip via thermal compression bonding [J] . Microelectronics & Reliability . 2020,第Jana期

机译：倒装芯片中铜柱焊料凸点通过热压键合的热循环可靠性
4. Lead-Free Solder Micro-Ball Bumps for the Next Generation of Flip Chip Interconnection: Micro-Ball Materials, Bump Formation Process and Reliability [C] . Ishikawa, Shinji, Uchiyama, . 2007

机译：下一代倒装芯片互连的无铅焊料微型焊球：微型焊球材料，焊球形成工艺和可靠性
5. Reliability study and technology development of solder-bumped flip chip on low-cost substrate. [D] . Xiao, Guo Wei. 2002

机译：低成本衬底上凸焊倒装芯片的可靠性研究和技术开发。
6. Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints [O] . Jiajie Fan, Jie Wu, Changzhen Jiang, 2020

机译：随机空隙的产生以及热冲击载荷对发光二极管倒装芯片焊点机械可靠性的影响
7. Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps [O] . Yasumitsu Orii, Kazushige Toriyama, Sayuri Kohara, 2011

机译：用焊接铜柱凸块的外围倒装芯片互连的微结构观察和可靠性行为

Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps

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