SEMICONDUCTOR CHIP PACKAGE HAVING A THROUGH ELECTRODE CAPABLE OF IMPROVING POWER SUPPLY QUALITY AND A TRANSMISSION PROPERTY OF A HIGH SPEED SIGNAL, AND A PRINTED CIRCUIT BOARD

摘要

PURPOSE: A semiconductor chip package having a through electrode and a printed circuit board are provided to change characteristic impedance of a through electrode by controlling arrangement of the through electrode.;CONSTITUTION: A semiconductor chip package(100) having a through electrode includes a signal electrode, a power electrode, and a ground electrode. The signal electrode(132) penetrates a semiconductor chip, and delivers a signal to the semiconductor chip(110). The power electrode(134) and the ground electrode(136) penetrate the semiconductor chip, and deliver a power and a ground to the semiconductor chip. The power electrode and the ground electrode are positioned in an adjacent distance from each signal electrode.;COPYRIGHT KIPO 2010